● Liu W , Wang Y , Ma Y , et al. Interfacial microstructure evolution and shear behavior of Au-20Sn/(Sn)Cu solder joints bonded at 250 ℃.
Materials Science and Engineering, 2016, 651(JAN.10):626-635.
● Ma Y , Luo H , Liu W , et al. Effects of Bi addition on interfacial reactions and mechanical properties of In-3Ag-xBi/Cu solder joints.
Journal of materials ence, 2016, 27(1):103-110.
● Liu W , Wang Y , Ma Y , et al. Interfacial reaction mechanism and kinetics between Au-20Sn and Sn.
Journal of materials ence, 2016, 27(6):5982-5991.
● Ma Y , Wu T , Liu W , et al. Interfacial microstructure evolution and shear behavior of Au–12Ge/Ni solder joints during isothermal aging.
Journal of Materials Science Materials in Electronics, 2016.
● Liu W , Wang Y , Ma Y , et al. Nanoindentation study on micromechanical behaviors of Au-Ni-Sn intermetallic layers in Au-20Sn/Ni solder joints.
Materials Science & Engineering, 2016, 653(JAN.20):13-22.
● Wang M , Huang L , Liu W , et al. Influence of cumulative strain on microstructure and mechanical properties of multi-directional forged 2A14 aluminum alloy.
Materials Science & Engineering, 2016, 674(SEP.30):40-51.
● 刘文胜，汤娅，马运柱，黄宇峰.回流次数对Au80Sn20_Cu焊点显微组织及剪切性能的影响.
《粉末冶金材料科学与工程》, 2016, 21(2):303-310
● Liu W , Wang Z , Ma Y , et al. Investigation of tungsten/steel brazing using Ta and Cu interlayer Fusion.
Engineering and Design, 2016, 113(DEC.):102-108.
● 马运柱，叶晓珊，刘文胜，张佳佳.机械合金化制备Ni-W(B)非晶-纳米晶的粉末特性.
《稀有金属材料与工程》, 2016(2):459-464
● C. Liu, Y. Z. Ma,* W. S. Liu, Z. Shi and S. W. Tang. Influence of Various Concentrations (TiC and TiN) on the Microstructure and Properties of Ti(CN)-Based Cermets Prepared by Spark Plasma Sintering.
Trans. Ind. Ceram. Soc., vol. 75, no. 3, pp. 1-4 (2016)
