● Liu W, Wang Y, Ma Y, et al. Nanoindentation study on micromechanical behaviors of Au-Ni-Sn intermetallic layers in Au-20Sn/Ni solder joints.
Materials Science & Engineering A, 2016, 653:13-22
● Liu W, Wang Y, Ma Y, et al. Interfacial reaction mechanism and kinetics between Au–20Sn and Sn.
Journal of Materials Science Materials in Electronics, 2016, 27(6):1-10
● Ma Y, Luo H, Liu W, et al. Effects of Bi addition on interfacial reactions and mechanical properties of In–3Ag–xBi/Cu solder joints.
Journal of Materials Science Materials in Electronics, 2016, 27(1):103-110
● Ma Y, Wu T, Liu W, et al. Interfacial microstructure evolution and shear behavior of Au–12Ge/Ni solder joints during isothermal aging.
Journal of Materials Science Materials in Electronics, 2016, 28(4):1-10
● Liu Wensheng, Long Luping, Ma Yunzhu, Wu Lei. Microstructure evolution and mechanical properties of Mg/Al diffusion bonded joints.
Journal of Alloys and Compounds, 2015, 643: 34–39.
● Cai Qingshan, Liu Wensheng, Ma Yunzhu, et al. Diffusion brazing of tungsten and steel using Ti–Ni liquid phase forming interlayer.
Fusion Engineering & Design, 2015:67–72.
● Cai Qingshan, Liu Wensheng, Ma Yunzhu, et al. Microstructure, residual stresses and mechanical properties of diffusion bonded tungsten–steel joint using a V/Cu composite barrier interlayer.
International Journal of Refractory Metals & Hard Materials, 2015, 48:312–317.
● Cai Qingshan, Liu Wensheng, Ma Yunzhu, et al. Diffusion brazing of tungsten and steel using Ti–Ni liquid phase forming interlayer.
Fusion Engineering & Design, 2015:67–72.
● Ma Yunzhu, Cheng Fan, Liu Wensheng, et al. Research progress of Ag3PO4-based photocatalyst: Fundamentals and performance enhancement
Transactions of Nonferrous Metals Society of China, 2015, 25(1):112–121.
● Zhang Jiajia, Liu Wensheng, Ma Yunzhu, et al. Preparation and properties of Ni68.6W17.9B13.5 metallic glass
Transactions of Nonferrous Metals Society of China, 2015, 25:1575–1579.
