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● Luping Long, Wensheng Liu, Yunzhu Ma, Lei Wu. Evolution of voids in Mg/Al diffusion bonding process.
High Temperature Materials and Processes. 2016, 36 (10): 985-992

● Wensheng Liu, Zixuan Wang, Yunzhu Ma, Qingshan Cai, Investigation of tungsten/steel brazing using Ta and Cu interlayer.
Fusion Engineering and Design 113 (2016) 102–108

● 刘文胜, 汤娅, 马运柱,等. 回流次数对Au80Sn20/Cu焊点显微组织及剪切性能的影响.
《粉末冶金材料科学与工程》, 2016, 21(2):303-310

● Liu W, Wang Y, Ma Y, et al. Interfacial microstructure evolution and shear behavior of Au–20Sn/(Sn)Cu solder joints bonded at 250 °C.
Materials Science & Engineering A, 2016, 651:626-635

● Liu W, Wang Y, Ma Y, et al. Nanoindentation study on micromechanical behaviors of Au-Ni-Sn intermetallic layers in Au-20Sn/Ni solder joints.
Materials Science & Engineering A, 2016, 653:13-22

● Liu W, Wang Y, Ma Y, et al. Interfacial reaction mechanism and kinetics between Au–20Sn and Sn.
Journal of Materials Science Materials in Electronics, 2016, 27(6):1-10

● Ma Y, Luo H, Liu W, et al. Effects of Bi addition on interfacial reactions and mechanical properties of In–3Ag–xBi/Cu solder joints.
Journal of Materials Science Materials in Electronics, 2016, 27(1):103-110

● Ma Y, Wu T, Liu W, et al. Interfacial microstructure evolution and shear behavior of Au–12Ge/Ni solder joints during isothermal aging.
Journal of Materials Science Materials in Electronics, 2016, 28(4):1-10

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