● 雷纯鹏*, 马运柱*, 刘文胜, 刘阳.新型含片状晶WC-10wt%Co 硬质合金的制备及其性能研究.
《稀有金属》, 2017, 41(4) :337-342
● Yang Liu, Wensheng Liu, Yunzhu Ma*, Shangru. Meng, Chao Liu, Luping. Long, Siwei. Tang. A comparative study on wear and corrosion behaviour of HVOF and HVAF sprayed WC 10Co 4Cr coatings.
Surface Engineering, 2017, 33(1) 63-71
● Qingshan Cai, Wensheng Liu, Zhongwei Zhao, Yunzhu Ma, Chaoping Liang, Investigation of tungsten/steel diffusion bonding with Ni–Fe cladding on tungsten substrate.
Fusion Eng. Des. Available online 2017
● 刘文胜，李银，马运柱，王娟，罗涛，徐书恒. 烧结温度对硼硅酸铝纤维组织结构和性能的影响
《硅酸盐学报》, 2017 (6) :847-854
● 余强, 刘文胜, 马运柱,等. 等温时效对Cu/Sn-3.5Ag/Ni(P)UBM互连焊接件界面微观组织及剪切性能的影响.
《粉末冶金材料科学与工程》, 2017, 22(3):390-398
● Y.F. Huang, W.S. Liu, Y.Z. Ma, et al. Effects of cooling rate and magnetic field on solidification characteristics of Au80Sn20 eutectic solder.
Electron. Mater.: Materials in Electronics. 2017:1-10
● Liu W , Wang Y , Ma Y , et al. Interfacial microstructure evolution and shear behavior of Au-20Sn/(Sn)Cu solder joints bonded at 250 ℃.
Materials Science and Engineering, 2016, 651(JAN.10):626-635.
● Ma Y , Luo H , Liu W , et al. Effects of Bi addition on interfacial reactions and mechanical properties of In-3Ag-xBi/Cu solder joints.
Journal of materials ence, 2016, 27(1):103-110.
● Liu W , Wang Y , Ma Y , et al. Interfacial reaction mechanism and kinetics between Au-20Sn and Sn.
Journal of materials ence, 2016, 27(6):5982-5991.
● Ma Y , Wu T , Liu W , et al. Interfacial microstructure evolution and shear behavior of Au–12Ge/Ni solder joints during isothermal aging.
Journal of Materials Science Materials in Electronics, 2016.
